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Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics

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Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics

Brand Name : Dowsil

Model Number : TC-5860

Certification : TDS,SDS,COA

Place of Origin : USA

MOQ : 1

Price : 3532

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 1000

Delivery Time : 3-5

Packaging Details : 1KG

brand : Dowsil

model : TC-5860

Specifications : 1kg

color : Gray

category : Thermally conductive compound

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Dowsil TC-5860 High-Power Electronics Thermally Conductive Compound​
Simple attributes

Dowsil TC-5860 is a one-part, gray, non-curing grease-like thermally conductive compound. It features high thermal conductivity, high dielectric strength, and a solvent-free stable formulation, designed to simplify production and ensure long-term reliability.

Product Introduction

Dowsil TC-5860 Thermally Conductive Compound is a grease-like material highly loaded with thermally conductive fillers in a silicone matrix. It is designed to create an efficient thermal bridge between the heat source (e.g., chip) and the heat sink by reducing the thermal resistance at the interface, thereby improving heat transfer. This is crucial for modern high-power electronics, which continuously pursue higher performance and more compact designs, as it effectively lowers operating temperatures, enhancing efficiency and extending service life.

Property Typical Value Test Method
Thermal Conductivity 3.0 W/m·K ASTM D5470
Dielectric Strength > 10 kV/mm ASTM D149
Consistency 400 ~ 600 Pa·s -
Operating Temperature -40°C to +150°C -
Special attributes

A key special attribute of this product is its solvent-free formulation. This ensures outstanding material stability after the container is opened, with no change in viscosity over time, guaranteeing consistent and easy application, whether through automated dispensing or stencil printing. Furthermore, its non-curing nature allows it to remain flexible throughout the device's lifespan, adapting to thermal expansion and contraction to maintain optimal interfacial contact.

Application scenarios

Dowsil TC-5860 is widely used in various high-power electronics requiring efficient thermal management. Typical application scenarios include power converters, automotive electronic control units (ECUs), cooling for server CPUs/GPUs, industrial drive inverters, and high-power LED lighting systems. It is particularly suitable for applications demanding thin bond line thicknesses (BLT) to maximize heat dissipation efficiency.

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics


Product Tags:

High Thermal Conductivity Thermally Conductive Compound

      

High Dielectric Strength Silicone Adhesive

      

Solvent-Free Thermal Grease

      
China Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics factory

Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics Images

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