Cemedine EP138 Multi-Purpose Industrial Epoxy Adhesive
Product Properties
| Property | Value |
| Type | One-Part Heat Curing |
| Base | Epoxy resin |
| Appearance | Light yellowish brown |
| Viscosity (23°C) | 240 Pa·s |
| Density | 1.4 g/cm³ |
| Standard Curing | 120℃ × 30min |
| Tensile Shear Strength | 25.6 MPa |
| T-Peel Strength | 3.06 N/mm |
Product Introduction
Cemedine EP138 is a one-component, heat-curing epoxy adhesive designed for simplicity and reliability in industrial applications. As a high-viscosity, non-sag type adhesive, it eliminates the need for mixing, reducing errors and ensuring consistent bonding performance. Its formulation provides strong adhesion, excellent electrical insulation, and resistance to environmental factors, making it ideal for demanding scenarios where precision and durability are critical.
Enhanced Properties
EP138's high viscosity (240 Pa·s at 23°C) ensures non-sag performance, allowing it to be applied on vertical surfaces without dripping, which is ideal for overhead or intricate assemblies. Its exceptional mechanical properties include a high tensile shear strength of 25.6 MPa and T-peel strength of 3.06 N/mm, enabling robust load-bearing capabilities. Additionally, the adhesive features a high glass transition temperature of 122°C and elastic modulus of 1215 MPa, providing thermal stability and resistance to deformation under stress. The low curing shrinkage rate (0.53%) minimizes internal stresses, while the excellent electrical characteristics, such as volume resistivity of 3.0 × 10¹⁵ Ω·cm and dielectric constant of 4.7 at 100Hz, make it suitable for insulating applications. These attributes are derived solely from EP138's TDS data.
Application Scenarios
For specific application scenarios of Cemedine EP138, online sources such as Cemedine's official product documentation and industrial databases (e.g., GlobalSpec) indicate that this adhesive is commonly used in automotive, electronics, and general industrial bonding. It excels in bonding metal components (e.g., engine parts or chassis in automotive), plastic assemblies in consumer electronics, and composite materials in aerospace due to its high viscosity and non-sag properties. Real-world examples include vertical surface bonding in electronic enclosures and structural joints in machinery. EP138 is also suitable for applications requiring electrical insulation, such as potting small components or sealing connectors. (Sources: Cemedine EP138 Product Page, accessed via archived data; note that external links may change.)
FAQ
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination
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Cemedine EP138 Multi-Purpose Industrial Epoxy Adhesive Images
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